The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Apr. 16, 2020
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Hideaki Momose, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H04N 5/225 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H04N 5/2251 (2013.01); H05K 1/028 (2013.01); H05K 1/0219 (2013.01); H05K 1/0245 (2013.01); H05K 1/147 (2013.01); H05K 2201/0792 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09681 (2013.01);
Abstract

An electronic apparatus which achieves ease of incorporating flexible boards into the electronic apparatus and ease of impedance control at the same time. A first flexible board and a second flexible board are placed along a structure having a bent portion and a flat portion. Differential signal wires are wired on one surface of the first flexible board placed between the structure and the second flexible board, and first ground wires for impedance control of the differential signal wires are wired on the other surface and on a rear side of the differential signal wires. Second ground wires for impedance control of the differential signal wires are wired on one surface of the second flexible board the one surface of the first flexible board faces. A wiring density of the first and second ground wires differs between an area along the bent portion and an area along the flat portion.


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