The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Sep. 17, 2018
Applicant:

Meas Switzerland S.a.r.l., Bevaix, CH;

Inventor:

Predrag Drljaca, Neuchatel, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 19/00 (2006.01); B81C 1/00 (2006.01); H04R 1/06 (2006.01); H04R 31/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H04R 19/00 (2013.01); B81C 1/0023 (2013.01); B81C 1/00309 (2013.01); H04R 1/06 (2013.01); H04R 31/006 (2013.01); H05K 1/181 (2013.01); B81B 2201/0214 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/012 (2013.01); B81C 2203/019 (2013.01); B81C 2203/035 (2013.01); H04R 2499/10 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1147 (2013.01);
Abstract

The present invention relates to a sensor arrangement, to a corresponding method of assembling such a sensor arrangement, and to a sensor system. The sensor arrangement comprises at least one transducer element for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; and a sensor substrate comprising the transducer element. The sensor substrate is mountable on a circuit carrier in a way that a media channel penetrating the circuit carrier allows access of the at least one measurand to the transducer element. The circuit carrier has an electrically conductive solderable first sealing pattern which surrounds the media channel at least partly and which is aligned with a solderable second sealing pattern arranged on the sensor substrate, so that a soldered sealing connection, which at least partly surrounds the media channel, is formed between the first sealing pattern and the second sealing pattern.


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