The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Sep. 17, 2018
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Adrian Severin Matusek, Stuttgart-Rohr, DE;
Andreas Kugler, Alfdorf, DE;
Stefan Apelt, Gerlingen, DE;
Ulrich Schaaf, Kaisersbach, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01S 4/00 (2006.01); H04N 5/225 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); H01L 27/14618 (2013.01); H01L 27/14683 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H04N 5/2258 (2013.01);
Abstract
A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.