The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Nov. 29, 2018
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventor:

Miyoshi Mabuchi, Makinohara, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 43/048 (2006.01); H01B 7/08 (2006.01); H01B 7/00 (2006.01); H01B 13/06 (2006.01);
U.S. Cl.
CPC ...
H01R 43/048 (2013.01); H01B 7/0009 (2013.01); H01B 7/08 (2013.01); H01B 13/06 (2013.01); Y10T 29/49185 (2015.01); Y10T 29/53217 (2015.01); Y10T 29/53235 (2015.01);
Abstract

A multicore cable manufacturing method for manufacturing a multicore cable with reduced influence on high-frequency characteristics is provided. The multicore cable manufacturing method includes a plurality of crimping dies, each crimping die being constituted of a pair of dies to connect, by crimping, each electric wire and each terminal. The plurality of crimping dies is configured to substantially simultaneously connect the plurality of electric wires and the plurality of terminals, and the crimping die is configured to connect a front end portion of each electric wire and each terminal with the front end portions of the plurality of electric wires extending radially centering on a branch point located on a rear side of the front end portion.


Find Patent Forward Citations

Loading…