The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Mar. 29, 2018
Applicant:
Te Connectivity Germany Gmbh, Bensheim, DE;
Inventors:
Rudi Blumenschein, Ellwangen, DE;
Frank Kaehny, Lautertal, DE;
Kai Kioschis, Moerlheim, DE;
Andre Martin Dressel, Lampertheim, DE;
Assignee:
TE Connectivity Germany GmbH, Bensheim, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01R 4/02 (2006.01); H01M 2/20 (2006.01); H01R 43/02 (2006.01); H01R 11/28 (2006.01); H01R 4/38 (2006.01); H01R 4/34 (2006.01); B23K 101/38 (2006.01); H01R 4/44 (2006.01); H01R 11/12 (2006.01); H01R 11/16 (2006.01);
U.S. Cl.
CPC ...
H01R 4/027 (2013.01); H01M 2/206 (2013.01); H01R 4/022 (2013.01); H01R 4/028 (2013.01); H01R 43/0235 (2013.01); H01R 43/0263 (2013.01); B23K 2101/38 (2018.08); H01M 2220/20 (2013.01); H01R 4/34 (2013.01); H01R 4/38 (2013.01); H01R 4/44 (2013.01); H01R 11/12 (2013.01); H01R 11/16 (2013.01); H01R 11/281 (2013.01);
Abstract
An electrical contact for forming a materially bonded, electrically conductive connection to a mating contact comprises a contact surface and a soldering body. The contact surface has a recess extending into the contact surface. The soldering body is formed of a hard solder material and is pressed into the recess. The soldering body protrudes out from the recess beyond the contact surface.