The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Nov. 12, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Richard Alan Haight, Mahopac, NY (US);

Ali Afzali-Ardakani, Ossining, NY (US);

Vivekananda P. Adiga, Ossining, NY (US);

Martin O. Sandberg, Ossining, NY (US);

Hanhee Paik, Danbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/02 (2006.01); G06N 10/00 (2019.01); H01L 39/24 (2006.01); H01L 39/22 (2006.01);
U.S. Cl.
CPC ...
H01L 39/025 (2013.01); G06N 10/00 (2019.01); H01L 39/223 (2013.01); H01L 39/2493 (2013.01);
Abstract

Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing an adhesion layer onto a superconducting resonator and a silicon substrate that are comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the adhesion layer can comprise a chemical compound having a thiol functional group.


Find Patent Forward Citations

Loading…