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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11145799 B1

PDFFull Text
Date of Patent:
Oct. 12, 2021

Filed:

Jul. 14, 2020

Led module having led chips as light source

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Masahiko Kobayakawa, Kyoto, JP;

Shinji Isokawa, Kyoto, JP;

Riki Shimabukuro, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Duy T Nguyen

Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/32 (2010.01); H01L 33/56 (2010.01); H01L 21/66 (2006.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/647 (2013.01); H01L 22/12 (2013.01); H01L 25/0753 (2013.01); H01L 27/0248 (2013.01); H01L 29/866 (2013.01); H01L 33/32 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 24/73 (2013.01); H01L 33/50 (2013.01); H01L 33/64 (2013.01); H01L 33/641 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01322 (2013.01);
Abstract

An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.

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