IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11145795 B1

PDFFull Text
Date of Patent:
Oct. 12, 2021

Filed:

May. 30, 2017

Light emitting apparatus and method for manufacturing same

Applicants:

Citizen Electronics Co., Ltd., Fujiyoshida, JP;

Citizen Watch Co., Ltd., Nishitokyo, JP;

Inventors:

Koki Hirasawa, Otsuki, JP;

Nodoka Oyamada, Fujiyoshida, JP;

Yuji Omori, Yamanashi, JP;

Assignees:

CITIZEN ELECTRONICS CO., LTD., Fujiyoshida, JP;

CITIZEN WATCH CO., LTD., Nishitokyo, JP;

Attorney:

Procopio, Cory, Hargreaves & Savitch LLP

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 33/56 (2010.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/13 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 21/563 (2013.01); H01L 23/3135 (2013.01); H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/64 (2013.01); H01L 33/644 (2013.01); H05K 1/0281 (2013.01); H05K 1/182 (2013.01); H05K 1/189 (2013.01); H01L 25/13 (2013.01); H01L 33/486 (2013.01); H01L 33/647 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2009 (2013.01);
Abstract

A light-emitting apparatus and a method for manufacturing the same are provided in which heat dissipation from an LED package to a heat sinking substrate is improved while electrical insulation therebetween is ensured. The light-emitting apparatus includes a circuit board having an opening, an LED package inserted into the opening from the back side of the circuit board and having an edge connected to the back side of the circuit board, and a heat sinking substrate disposed on the back side of the circuit board so as to be in contact with the LED package. The LED package includes: an LED device; a lead frame including a mounting part having an upper surface on which the LED device is mounted and a back surface being in contact with the heat sinking substrate, and an electrode part being thinner than the mounting part and electrically connected to the LED device and the circuit board; an insulating resin filled between the mounting part and the electrode part and between the electrode part and the heat sinking substrate; and a sealing resin filled into a region on the mounting part to seal the LED device.

Find Patent Forward Citations

Loading…