The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Dec. 16, 2019
Applicant:

Rohm Co., Ltd., Ukyo-ku Kyoto, JP;

Inventors:

Shozo Koyanagi, Ukyo-ku Kyoto, JP;

Seiji Nakashima, Ukyo-ku Kyoto, JP;

Assignee:

ROHM Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/495 (2006.01); H01L 25/16 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H02M 3/158 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 23/49517 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 25/16 (2013.01); H02M 3/1588 (2013.01); H05K 1/181 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13091 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A semiconductor device, includes: first semiconductor element including first and second electrodes; second semiconductor element including third and fourth electrodes; sealing resin covering the semiconductor elements; first, second, third, and fourth terminal portions respectively connected to the first, second, third, and fourth electrodes and exposed from the sealing resin; first island portion where the first semiconductor element is mounted; and second island portion where the second semiconductor element is mounted, wherein four quadrants divided by first imaginary line extending along second direction orthogonal to first direction and second imaginary line extending along third direction orthogonal to both the first and second directions are defined.


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