The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Mar. 06, 2019
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventors:
Katsuji Iguchi, Sakai, JP;
Masumi Maegawa, Sakai, JP;
Keiichi Sawai, Sakai, JP;
Hiroyoshi Higashisaka, Sakai, JP;
Takanobu Matsuo, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/74 (2013.01); H01L 21/67051 (2013.01); H01L 21/67144 (2013.01); H01L 21/67718 (2013.01); H01L 21/67721 (2013.01); H01L 21/687 (2013.01); H01L 21/6831 (2013.01);
Abstract
Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.