The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Jun. 22, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/193 (2006.01); H01L 41/047 (2006.01); H01L 41/45 (2013.01); H01L 41/113 (2006.01); H01L 23/00 (2006.01); H01L 23/047 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H02M 7/00 (2006.01); H02M 7/44 (2006.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/047 (2013.01); H01L 23/3735 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H02M 7/003 (2013.01); H02M 7/44 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H02P 27/06 (2013.01);
Abstract
The semiconductor device includes a semiconductor element substrate having an insulation property, and a wire for positioning the semiconductor element with respect to the semiconductor element substrate. The semiconductor element substrate includes a disposition region for disposing the semiconductor element. The wire is provided at least at a part of the periphery of the disposition region.