The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Mar. 03, 2020
Denso Corporation, Kariya, JP;
Naohisa Harada, Kariya, JP;
Hiroshi Kondo, Kariya, JP;
Kyosuke Ishikawa, Kariya, JP;
Atsushi Kawade, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A semiconductor module bonding structure includes: a semiconductor module including a semiconductor element and a positive terminal which is a plate-shaped power terminal electrically connected to the semiconductor element; and a main P bus bar which is a bus bar including a plate-shaped bonding part bonded to the positive terminal of the semiconductor module. The positive terminal of the semiconductor module which is one of the positive terminal and the bonding part of the main P bus bar that has a relatively small thickness is configures to be wider than the bonding part which is the other having a relatively large thickness, and the positive terminal and the bonding part are bonded together by fusion welding in the state of being arranged so that the respective thickness directions of the positive terminal and the bonding part are orthogonal to each other.