The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Sep. 24, 2019
Infineon Technologies Ag, Neubiberg, DE;
Stefan Macheiner, Kissing, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A package includes a semiconductor die having a first load terminal at a first side and a second load terminal at a second side opposite the first side, a metal block attached to the second load terminal and providing a single primary thermal conduction path of the package, a first metal lead electrically connected to the first load terminal, a second metal lead electrically connected to the second load terminal, and a mold compound embedding the semiconductor die, the metal block, and each metal lead. Each metal lead and the metal block are exposed from the mold compound at a first side of the package. Each metal lead is exposed from the mold compound at a second side of the package opposite the first side, so that the package is configured for surface mounting at either the first side or the second side of the package.