The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Aug. 26, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Akihiro Fujii, Kyoto, JP;
Toru Komatsu, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A module that has excellent heat dissipation performance and enables height reduction easily is provided. The module includes a wiring substrate, a plurality of components mounted on the top surface of the wiring substrate, a plurality of heat dissipation members, a sealing resin layer laminated on the top surface of the wiring substrate, and a shield film that covers surfaces of the sealing resin layer. The heat dissipation member is formed into a strip-shaped sheet. In addition, both end portions of the heat dissipation member are in contact with the top surface of the wiring substrate and also with the components disposed between the both end portions. The heat dissipation member thereby forms a heat dissipation path that transmits heat generated by the component to the wiring substrate.