The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Aug. 08, 2018
Applicant:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Jun Akedo, Ibaraki, JP;

Hiroki Tsuda, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/12 (2006.01); F28F 3/00 (2006.01); F28F 21/04 (2006.01); F28F 21/08 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); F28F 3/00 (2013.01); F28F 21/04 (2013.01); F28F 21/08 (2013.01); H01L 23/12 (2013.01); H01L 23/142 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01);
Abstract

A heat-radiating substrate with a high insulation-withstand voltage and an excellent heat-radiating property is provided. The heat-radiating substrate includes: a metal base material; a metal thin layer formed over the metal base material and having a hardness higher than a hardness of the metal base material; and a ceramic layer over the metal thin layer. Alternatively, the heat-radiating substrate includes, instead of the metal thin layer, a hardened layer serving as a surface layer of the metal base material and having a hardness higher than the hardness of the metal base material. The metal thin layer and the hardened layer are able to enhance compressive stress or prevent release of the compressive stress generated in the ceramic layer by a mechanical impact applied to the ceramic layer.


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