The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Jan. 29, 2020
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Masashi Hoya, Siojiri, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 21/66 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 23/5386 (2013.01); H01L 25/16 (2013.01);
Abstract

A manufacturing method of a semiconductor module including a trimming resistance element and a plurality of transistor chips connected mutually in parallel, in which gate electrodes are connected to one end of the trimming resistance element, including: measuring elapsed time and a gate-source voltage value when a predetermined gate current is injected into the gate electrodes and a predetermined drain current flow; calculating a gate-source capacity on the basis of the gate-source voltage value; determining a compensation gate resistance value on the basis of the gate-source voltage value and the gate-source capacity; and changing a resistance value of the trimming resistance element such that the resistance value of the trimming resistance element is conformed to the compensation gate resistance value.


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