The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Nov. 09, 2020
Applicant:
Cerebras Systems Inc., Los Altos, CA (US);
Inventors:
Jean-Philippe Fricker, Los Altos, CA (US);
Tim Botsford, Los Altos, CA (US);
Philip Ferolito, Los Alto, CA (US);
Paul Kennedy, Los Altos, CA (US);
Assignee:
Cerebras Systems Inc., Los Altos, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/48 (2006.01); G06T 7/00 (2017.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); G06T 7/001 (2013.01); H01L 21/4853 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); G06T 2207/30141 (2013.01); G06T 2207/30148 (2013.01);
Abstract
The integrated circuit assembly can include: a semiconductor and a substrate (e.g., PCB). The integrated circuit assembly can optionally include: a compliant connector, a thermal management, and a securing element. The semiconductorcan include a first alignment feature. (e.g., orifice). The substrate can include a second alignment feature (e.g., alignment target) and conductive pads. The substrate can optionally include a cavity.