The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Jun. 14, 2017
Seoul National University R&db Foundation, Seoul, KR;
Republic of Korea (Management: Rural Development Administration), Jeonju-si, KR;
Jung Hoon Lee, Seoul, KR;
Sang Woong Baek, Seoul, KR;
Eun Yong Jeon, Seoul, KR;
Seung Yul Choi, Seoul, KR;
Kyoung Sub Park, Gyeongsangnam-do, KR;
Joon Kook Kwon, Gyeongsangnam-do, KR;
Kyung Hwan Yeo, Gyeongsangnam-do, KR;
In Ho Yu, Gyeongsangnam-do, KR;
Jae Han Lee, Gyeongsangnam-do, KR;
Seoul National University R&DB Foundation, Seoul, KR;
Republic Of Korea Rural Development Administration, Jeonju-si, KR;
Abstract
According to an exemplary embodiment, a microneedle probe device for measuring a sap flow rate of a plant includes: a substrate, of which at least a part is inserted into a plant, and a thickness and a width are microscales; a single metal wire provided on the substrate; a power source, which applies a current to the metal wire for a predetermined time and heats the metal wire; and a processor, which calculates a flow rate of sap through a movement of heat generated in the metal wire according to a flow of the sap within the plant.