The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Jun. 26, 2018
Applicant:

Satish G. Kandlikar, Rochester, NY (US);

Inventor:

Satish G. Kandlikar, Rochester, NY (US);

Assignee:

Rochester Institute of Technology, Rochester, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/08 (2006.01); H01L 23/473 (2006.01); F28F 3/02 (2006.01); F28D 21/00 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28F 13/08 (2013.01); H01L 23/473 (2013.01); F28D 2021/0028 (2013.01); F28F 3/02 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat transfer system including a fluid inlet; a fluid outlet; and a substrate in fluid communication with the fluid inlet and fluid outlet, the substrate including a heat exchange region having a heat transfer surface and a flow field adjacent the heat transfer surface, the flow field including a fluid flow area including an open region at the inlet, a heat transfer region in thermal communication with the heat exchange region, and a taper of the flow field cross-sectional area in the flow direction, wherein the flow field heat transfer region includes a plurality of spaced apart open enhancement features from 1 micron to 3 mm in size, and method for enhancing the heat transfer performance of an apparatus is disclosed.


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