The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Feb. 26, 2020
Applicant:
Toto Ltd., Kitakyushu, JP;
Inventors:
Yasutaka Nitta, Kitakyushu, JP;
Takuma Wada, Kitakyushu, JP;
Assignee:
Toto Ltd., Fukuoka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 28/04 (2006.01); H01J 37/32 (2006.01); C23C 30/00 (2006.01);
U.S. Cl.
CPC ...
C23C 28/042 (2013.01); C23C 30/00 (2013.01); H01J 37/32477 (2013.01); H01L 21/67023 (2013.01);
Abstract
According to one embodiment, a semiconductor manufacturing apparatus member includes a base and a particle-resistant layer. The base includes a main portion and an alumite layer. The main portion includes aluminum. The alumite layer is provided at a front surface of the main portion. The particle-resistant layer is provided on the alumite layer and includes a polycrystalline ceramic. An Al purity of the main portion is 99.00% or more.