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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11142669 B1

PDFFull Text
Date of Patent:
Oct. 12, 2021

Filed:

Mar. 04, 2020

Adhesive and method of encapsulating organic electronic device using the same

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hyun Jee Yoo, Daejeon, KR;

Yoon Gyung Cho, Daejeon, KR;

Suk Ky Chang, Daejeon, KR;

Jung Sup Shim, Daejeon, KR;

Suk Chin Lee, Daejeon, KR;

Kwang Jin Jeong, Chungbuk, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Dale E Page

Assistant Examiner:

Wilner Jean Baptiste

Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 23/29 (2006.01); C09J 7/10 (2018.01); C09J 163/00 (2006.01); H05B 33/04 (2006.01); C09J 7/35 (2018.01); C09J 7/00 (2018.01); H01L 51/56 (2006.01); H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 23/00 (2006.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); H01L 51/00 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); C08K 3/16 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); C09J 7/00 (2013.01); C09J 7/35 (2018.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/295 (2013.01); H01L 23/564 (2013.01); H01L 51/0035 (2013.01); H01L 51/0094 (2013.01); H01L 51/5246 (2013.01); H01L 51/5253 (2013.01); H01L 51/5256 (2013.01); H01L 51/5259 (2013.01); H01L 51/56 (2013.01); H05B 33/04 (2013.01); C08K 3/16 (2013.01); C08K 3/22 (2013.01); C08K 3/346 (2013.01); C08K 3/36 (2013.01); C08K 2003/162 (2013.01); C08K 2003/166 (2013.01); C08K 2003/2206 (2013.01); C09J 2203/326 (2013.01); C09J 2301/1242 (2020.08); C09J 2301/208 (2020.08); C09J 2301/304 (2020.08); C09J 2301/408 (2020.08); C09J 2463/00 (2013.01); H01L 51/0034 (2013.01); H01L 2251/301 (2013.01); H01L 2251/303 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

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