The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Mar. 18, 2020
Applicant:

Dura Operating, Llc, Auburn Hills, MI (US);

Inventor:
Assignee:

DUS Operating Inc., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); B60R 13/02 (2006.01); F21V 8/00 (2006.01); H05K 1/02 (2006.01); H05K 5/06 (2006.01); H05K 3/28 (2006.01); B29C 45/14 (2006.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); B29L 31/30 (2006.01); B60R 13/00 (2006.01);
U.S. Cl.
CPC ...
B60R 13/02 (2013.01); B29C 45/14 (2013.01); G02B 6/006 (2013.01); G02B 6/0065 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H05K 1/0274 (2013.01); H05K 3/284 (2013.01); H05K 5/065 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/3041 (2013.01); B60R 13/005 (2013.01); B60R 2013/0287 (2013.01); H05K 2201/10121 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

A trim panel assembly includes a printed foil extending for a first area, a printed circuit board disposed overtop the foil, the printed circuit board extending for a second area smaller than the first area, and a light guide disposed overtop the printed circuit board and having a perimeter. The perimeter is inset from the printed foil, and surrounds the printed circuit board, forming a sealed interface with the printed foil. At least a portion of the perimeter of the light guide is beveled. A reflector is disposed overtop the light guide. In an electronic assembly the reflector, the light guide, the printed circuit board, and the printed foil are disposed at least partially in a cavity of a molded support panel. The molded support panel is substantially planar, and a semi-transparent material is overmolded directly onto and overtop the electronic assembly and the molded support panel.


Find Patent Forward Citations

Loading…