The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Jul. 30, 2019
Applicant:

Casio Computer Co., Ltd., Tokyo, JP;

Inventor:

Hideki Takahashi, Ome, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B29C 33/02 (2006.01);
U.S. Cl.
CPC ...
B29C 66/71 (2013.01); B29C 33/02 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 2250/02 (2013.01);
Abstract

A production method for a shaped object includes preparing a formable resin sheet that includes a base made from a resin, and a thermally expansive layer provided on a first side of the base and containing a thermally expandable material, a thermal conversion layer forming step of forming a thermal conversion layer that contains an electromagnetic wave heat conversion material that converts electromagnetic waves to heat on a first side of the formable resin sheet, an electrically conductive layer forming step of forming an electrically conductive layer on a second side of the formable resin sheet, and an irradiating step of, after forming the thermal conversion layer and the electrically conductive layer, irradiating the thermal conversion layer with the electromagnetic waves to cause the thermal expansive layer to distend and cause the base to deform in accordance with the distension of the thermal expansive layer. The thermal conversion layer and the electrically conductive layer are formed such that at least a portion of the electrically conductive layer is opposite at least a portion of the thermal conversion layer, with the base and the thermally expansive layer interposed therebetween.


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