The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Nov. 15, 2019
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Te Connectivity Services Gmbh, Schaffhausen, CH;
Measurement Specialties (Chengdu) Ltd., Chengdu, CN;
Shenzhen Ami Technology Co., Ltd., Shenzhen, CN;
Fengchun Xie, Shanghai, CN;
Dandan Zhang, Shanghai, CN;
Roberto-Francisco Yi Lu, Bellevue, WA (US);
Lvhai Hu, Shanghai, CN;
Qinglong Zeng, Shenzhen, CN;
Lan Gong, Chengdu, CN;
Qian Ying, Chengdu, CN;
Yingcong Deng, Shanghai, CN;
Yun Liu, Shanghai, CN;
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
TE Connectivity Servies GmbH, Schaffhausen, CH;
Measurement Specialties (Chengdu) Ltd., Chengdu, CN;
Shenzhen AMI Technology Co, Ltd., Shenzhen, CN;
Abstract
A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.