The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Feb. 06, 2019
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tetsuya Tanaka, Fukuoka, JP;

Masahiko Akasaka, Fukuoka, JP;

Koji Sakurai, Fukuoka, JP;

Toshihiko Nagaya, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 3/02 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); H05K 13/04 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3447 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); H05K 3/3485 (2020.08); H05K 3/3489 (2013.01); H05K 13/0409 (2018.08); H05K 13/0465 (2013.01); H05K 13/0469 (2013.01); B23K 2101/42 (2018.08); H05K 2203/0126 (2013.01); H05K 2203/0139 (2013.01);
Abstract

In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.


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