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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11140786 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

Jan. 19, 2020

Thermal interface adhesion for transfer molded electronic components

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Timothy J. Chainer, Putnam Valley, NY (US);

Michael A. Gaynes, Vestal, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Daniel Morris

Otterstedt, Wallace & Kammer, LLP

Primary Examiner:

Peter Dungba Vo

Assistant Examiner:

Azm A Parvez

Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); B29C 45/37 (2006.01); H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 23/42 (2006.01); B29C 45/14 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 23/467 (2006.01); H01L 23/14 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); B29C 45/14655 (2013.01); B29C 45/372 (2013.01); H01L 21/565 (2013.01); H01L 23/367 (2013.01); H01L 23/42 (2013.01); H05K 1/0209 (2013.01); H05K 1/185 (2013.01); H05K 3/284 (2013.01); H01L 23/147 (2013.01); H01L 23/3121 (2013.01); H01L 23/3736 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/1316 (2013.01); Y10T 29/4913 (2015.01);
Abstract

An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

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