The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Mar. 19, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eric J. Campbell, Rochester, MN (US);

Joseph Kuczynski, North Port, FL (US);

Timothy J. Tofil, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 35/02 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); B29K 105/08 (2006.01); B29K 105/16 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B29C 35/02 (2013.01); B29C 35/0272 (2013.01); H05K 1/0201 (2013.01); B29K 2105/0872 (2013.01); B29K 2105/162 (2013.01); B29K 2995/0008 (2013.01); B29L 2031/3425 (2013.01); H05K 1/0366 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09009 (2013.01);
Abstract

A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.


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