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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11139748 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

Jun. 05, 2019

Power module, power converter device, and electrically powered vehicle

Applicant:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Inventors:

Kinya Nakatsu, Hitachinaka, JP;

Hiroshi Hozoji, Hitachiota, JP;

Takeshi Tokuyama, Hitachi, JP;

Yusuke Takagi, Hitachinaka, JP;

Toshiya Satoh, Hitachiota, JP;

Taku Oyama, Hitachi, JP;

Takanori Ninomiya, Hiratsuka, JP;

Assignee:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Hoa C Nguyen

Assistant Examiner:

Amol H Patel

Int. Cl.
CPC ...
H02M 7/00 (2006.01); H05K 7/20 (2006.01); H02M 7/44 (2006.01); H02M 7/5395 (2006.01); B60L 50/51 (2019.01); B60L 50/50 (2019.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/473 (2006.01); H01L 23/36 (2006.01); B60L 50/16 (2019.01); B60L 50/64 (2019.01); H02M 1/32 (2007.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); B60L 50/16 (2019.02); B60L 50/51 (2019.02); B60L 50/64 (2019.02); H01L 21/4882 (2013.01); H01L 23/36 (2013.01); H01L 23/473 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H02M 7/44 (2013.01); H02M 7/5395 (2013.01); H05K 7/205 (2013.01); H05K 7/209 (2013.01); H05K 7/20409 (2013.01); H05K 7/20927 (2013.01); B60L 2200/26 (2013.01); B60L 2210/40 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H02M 1/327 (2021.05); H02P 27/08 (2013.01); Y02T 10/70 (2013.01); Y02T 10/7072 (2013.01);
Abstract

A power module includes a double-sided electrode module, a power semiconductor element, a pair of base plates, and a connecting member. The double-sided electrode module has a plurality of electrode wiring boards and a power semiconductor element which are molded with a resin material. The pair of base plates has the double-sided electrode module sandwiched therebetween. The pair of base plates are connected via the connecting member. The connecting member is formed in a curved shape.

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