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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11139626 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

May. 17, 2018

Thermocompression apparatus and method of manufacturing electronic device

Applicant:

Tdk Corporation, Tokyo, JP;

Inventor:

Koki Sato, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01R 43/02 (2006.01); H01F 27/24 (2006.01); B23K 20/02 (2006.01); H01F 27/29 (2006.01); H01R 43/20 (2006.01); H01F 27/28 (2006.01); H01F 41/10 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
H01R 43/0249 (2013.01); B23K 20/025 (2013.01); H01F 27/24 (2013.01); H01F 27/29 (2013.01); H01R 43/20 (2013.01); B23K 2101/36 (2018.08); H01F 27/2823 (2013.01); H01F 27/292 (2013.01); H01F 41/10 (2013.01); H01R 43/0263 (2013.01);
Abstract

A thermocompression apparatus includes a stage and a heater chip. The stage includes an installation surface on which a component having a scheduled portion of thermocompression is placed. The heater chip is disposed to be freely movable to and from the scheduled portion of thermocompression of the component opposite to the installation surface of the stage and is configured to heat and press the scheduled portion of thermocompression. The installation surface includes a maximum convex and a pair of slope surfaces. The maximum convex is configured to contact with a bottom surface of the component. The pair of slope surfaces has heights decreasing respectively from the maximum convex toward both sides of the installation surface in a width direction of the component.

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