The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Apr. 16, 2021
Applicant:

Coreshell Technologies, Inc., San Leandro, CA (US);

Inventors:

Sourav Basu, Oakland, CA (US);

Jonathan Tan, San Leandro, CA (US);

Assignee:

CORESHELL TECHNOLOGIES, INC., San Leandro, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/04 (2006.01); H01M 4/139 (2010.01); H01M 10/0525 (2010.01); B05D 1/02 (2006.01); B05D 1/18 (2006.01); H01M 4/36 (2006.01); H01M 10/0587 (2010.01); H01M 4/38 (2006.01); C23C 18/16 (2006.01); B05D 1/28 (2006.01); B05D 1/26 (2006.01); B05D 1/38 (2006.01); H01M 10/04 (2006.01);
U.S. Cl.
CPC ...
H01M 4/0402 (2013.01); H01M 4/049 (2013.01); H01M 4/139 (2013.01); H01M 10/0525 (2013.01); B05D 1/02 (2013.01); B05D 1/18 (2013.01); B05D 1/26 (2013.01); B05D 1/28 (2013.01); B05D 1/38 (2013.01); C23C 18/1655 (2013.01); H01M 4/36 (2013.01); H01M 4/362 (2013.01); H01M 4/38 (2013.01); H01M 10/0409 (2013.01); H01M 10/0587 (2013.01);
Abstract

Methods, systems, and compositions for the liquid-phase deposition (LPD) of thin films. The thin films can be coated onto the surface of porous components of electrochemical devices, such as battery electrodes. Embodiments of the present disclosure achieve a faster, safer, and more cost-effective means for forming uniform, conformal layers on non-planar microstructures than known methods. In one aspect, the methods and systems involve exposing the component to be coated to different liquid reagents in sequential processing steps, with optional intervening rinsing and drying steps. Processing may occur in a single reaction chamber or multiple reaction chambers.


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