The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Oct. 19, 2017
Applicant:

Flexenable Limited, Cambridge, GB;

Inventor:

Guillaume Fichet, Cambridge, GB;

Assignee:

FLEXENBLE LIMITED, Cambridge, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/77 (2017.01); H01L 51/00 (2006.01); B01D 53/26 (2006.01); F26B 5/04 (2006.01); H01L 27/28 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0025 (2013.01); B01D 53/261 (2013.01); F26B 5/045 (2013.01); H01L 27/283 (2013.01); H01L 51/0026 (2013.01); H01L 51/0031 (2013.01); H01L 51/0541 (2013.01); B01D 2253/116 (2013.01); H01L 51/0512 (2013.01);
Abstract

A technique comprising: producing an unencapsulated stack of layers defining one or more electronic devices including an organic semiconductor element; and then subjecting the unencapsulated stack of layers to a water removal treatment in a vacuum oven in the presence of an external water adsorbent; wherein the water removal treatment comprises heating the unencapsulated stack of layers in the vacuum oven for a time period longer than a control time period at which a spike in oven pressure attributable to the release of water from the stack of layers would occur with heating under the same treatment conditions but without the water absorbing material.


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