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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11139420 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

May. 01, 2020

Led package structure

Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Chen-Hsiu Lin, New Taipei, TW;

Wen-Hsiang Lin, Taipei, TW;

Chung-Hsien Yu, New Taipei, TW;

Assignees:

LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., Changzhou, CN;

LITE-ON TECHNOLOGY CORPORATION, Taipei, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Marcos D Pizarro

Assistant Examiner:

Antonio B Crite

Int. Cl.
CPC ...
H01L 33/62 (2010.01); G01R 31/26 (2020.01); G01R 31/27 (2006.01); H01L 23/538 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 23/498 (2006.01); H01L 33/46 (2010.01); H01L 21/48 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); G01R 31/2635 (2013.01); G01R 31/27 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/52 (2013.01); H01L 33/60 (2013.01);
Abstract

An LED package structure includes a multilayered circuit board, a plurality of lighting elements, a control unit, a reflecting unit, a package unit, a plurality of test paths and a plurality of operation paths. The multilayered circuit board includes a plurality of testing pads, a first electrical connecting pad and a plurality of second electrical connecting pads. The lighting elements are disposed on the multilayered circuit board. The control unit is electrically connected to the lighting elements. The reflecting unit is disposed on the multilayered circuit board and surrounds the lighting elements. The package unit covers the lighting elements. The test paths are in electrical connection with the first electrical connecting pad, the lighting elements and one of the testing pads. The operation paths are in electrical connection with the first electrical connecting pad, the control unit, the lighting elements and one of the second electrical connecting pads.

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