The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
May. 22, 2019
Applicant:
Finisar Corporation, Sunnyvale, CA (US);
Inventors:
Tao Sun, Shanghai, CN;
Feng Wang, Shanghai, CN;
Wei Peng Nian, Shanghai, CN;
Ting Shi, Shanghai, CN;
Bing Qiu, Shanghai, CN;
Shao Jun Yu, Shanghai, CN;
Assignee:
II-VI DELAWARE, INC., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 23/00 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01L 31/12 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); G02B 6/428 (2013.01); G02B 6/4279 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/85986 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01);
Abstract
In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.