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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11139297 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

Mar. 19, 2019

Circuit arrangement, redistribution board, module and method of fabricating a half-bridge circuit

Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventor:

Elvir Kahrimanovic, Villach, AT;

Assignee:

Infineon Technologies Austria AG, Villach, AT;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 23/495 (2006.01); H03K 17/687 (2006.01); H02M 7/00 (2006.01); H01L 23/00 (2006.01); H02M 7/493 (2007.01);
U.S. Cl.
CPC ...
H01L 27/0922 (2013.01); H01L 23/49531 (2013.01); H01L 23/49575 (2013.01); H01L 24/00 (2013.01); H02M 7/003 (2013.01); H02M 7/493 (2013.01); H03K 17/6871 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01);
Abstract

In an embodiment, a circuit arrangement is provided that includes a half-bridge circuit and a substrate having a major surface. The half-bridge circuit includes a high voltage node, a low voltage node and an output node. A high side switch and a low side switch are coupled in series and provide a pair and n pairs are coupled in parallel between the high voltage node and the low voltage node, n being an integer greater than or equal to 2. The output node is provided by an output connector on the major surface of the substrate. The output connector has an axis perpendicular to the major surface of the substrate and the n pairs are arranged on the major surface of the substrate and are uniformly distributed around the axis of the output connector.

Find Patent Forward Citations

Kahrimanovic, Elvir. (2021). Circuit arrangement, redistribution board, module and method of fabricating a half-bridge circuit (U.S. Patent No. 11139297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11139297

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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