The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Mar. 10, 2020
Western Digital Technologies, Inc., San Jose, CA (US);
Chien Te Chen, Taichung, TW;
Cong Zhang, Shanghai, CN;
Hsiang Ju Huang, Taichung, TW;
Xuyi Yang, Shanghai, CN;
Yu Ying Tan, Taichung, TW;
Han-Shiao Chen, Taichung, TW;
Western Digital Technologies, Inc., San Jose, CA (US);
Abstract
A land grid array semiconductor device is disclosed which is configured for removable insertion to and from a host device. The land grid array semiconductor device may include a first set of one or more contact fingers on the first surface of the land grid array semiconductor device, and a second set of one or more contact fingers on the second surface of the land grid array semiconductor device. In order to electrically couple the second set of one or more contact fingers, one or more electrical connectors may be provided physically extending between the second set of one or more contact fingers and at least one of the substrate and the at least one semiconductor die.