The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Feb. 12, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Takashi Iwamoto, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/66 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/565 (2013.01); H01L 21/76879 (2013.01); H01L 23/66 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 25/50 (2013.01); H01L 2223/6611 (2013.01);
Abstract
A manufacturing method for an electronic component includes forming an electrically conductive pillar on a surface of a support, forming an intermediate layer covering a side surface of the pillar, forming a conductor layer covering a side surface of the intermediate layer, and molding a resin structure covering a side surface of the conductor layer.