The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Apr. 13, 2020
Applicant:

Volkswagen Aktiengesellschaft, Wolfsburg, DE;

Inventors:

Andreas Lemke, Ummendorf, DE;

Marcus Klink, Salzgitter, DE;

Bastian Schaar, Braunschweig, DE;

Werner Rössler, Neufahrn, DE;

Frank Wesche, Velpke, DE;

Henning Volkmar, Isenbüttel, DE;

Lutz Lackenmacher, Rötgesbüttel, DE;

Bastian Gröger, Grasleben, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 24/72 (2013.01); H01L 23/3672 (2013.01); H01L 23/49844 (2013.01); H01L 25/072 (2013.01);
Abstract

A semiconductor device comprising at least a semiconductor component, a heat sink, a connecting element and an electrical circuit connected to the heat sink in an electrically conductive manner; wherein the semiconductor component and the heat sink are arranged at a distance from one another and are electrically and thermally conductively connected via the connecting element, wherein an electrical current can be supplied to the electrical circuit via the heat sink.


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