The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Oct. 03, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, a first encapsulant covering at least portions of the inactive surface and a side surface of the semiconductor chip, a connection structure having first and second regions disposed sequentially on the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and including a ground pattern layer, and a metal layer disposed on the upper surface of the first encapsulant, and extending from the upper surface of the first encapsulant to the side surface of the first region of the connection structure. The first region of the connection structure has a first width, and the second region has a second width, smaller than the first width.