The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Sep. 09, 2019
Applicant:

Bae Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);

Inventors:

Jeffrey A. Zimmerman, Manassas, VA (US);

Landon J. Caley, Fredricksburg, VA (US);

Richard J. Ferguson, Bealeton, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/48 (2006.01); H01L 21/66 (2006.01); H01L 21/48 (2006.01); H05K 3/22 (2006.01); C23C 14/14 (2006.01); C23C 14/22 (2006.01); C23C 16/04 (2006.01); C23C 16/06 (2006.01); B05D 5/12 (2006.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); B05D 5/12 (2013.01); C23C 14/14 (2013.01); C23C 14/221 (2013.01); C23C 16/047 (2013.01); C23C 16/06 (2013.01); C23C 16/486 (2013.01); H01L 21/485 (2013.01); H05K 3/225 (2013.01); H05K 2203/092 (2013.01); H05K 2203/162 (2013.01);
Abstract

A method for modifying a portion of a substrate after production is described herein. The method can include diagnosing a circuit operation error causing a malfunction, identifying a first contact on the substrate, and connecting, electrically, the first contact to a second contact with at least one trace. The trace is done with a focused ion beam. The method can include diagnosing an error on an operative area of a post-manufacture circuit board causing a malfunction; introducing a metal precursor into a focused ion beam chamber; ionizing the metal precursor by contacting it with a gallium ion beam into a conductive metal and a further ion; depositing a first portion of a conductive metal onto a substrate to form a first trace; and forming the first trace between the operative area and a non-operative area thereby connecting the operative area and the non-operative area.


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