The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Aug. 03, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Tenko Yamashita, Schenectady, NY (US);

Takashi Ando, Tuckahoe, NY (US);

Oleg Gluschenkov, Tannersville, NY (US);

Chen Zhang, Guilderland, NY (US);

Koji Watanabe, Rensselaer, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/324 (2006.01); H01L 29/49 (2006.01); H01L 21/762 (2006.01); H01L 21/265 (2006.01); H01L 27/092 (2006.01); H01L 29/786 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823885 (2013.01); H01L 21/265 (2013.01); H01L 21/308 (2013.01); H01L 21/324 (2013.01); H01L 21/76224 (2013.01); H01L 21/823814 (2013.01); H01L 21/823842 (2013.01); H01L 27/092 (2013.01); H01L 29/4966 (2013.01); H01L 29/78642 (2013.01);
Abstract

A method of forming a semiconductor structure includes forming one or more vertical fins each including a first semiconductor layer providing a vertical transport channel for a lower vertical transport field-effect transistor (VTFET) of a stacked VTFET structure, an isolation layer over the first semiconductor layer, and a second semiconductor layer over the isolation layer providing a vertical transport channel for an upper VTFET of the stacked VTFET structure. The method also includes forming a first gate stack including a first gate dielectric layer and a first gate conductor layer surrounding a portion of the first semiconductor layer of the vertical fins. The method further includes forming a second gate stack including a second gate dielectric layer and a second gate conductor layer surrounding a portion of the second semiconductor layer of the vertical fins. The first gate conductor layer and the second gate conductor layer are the same material.


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