The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Jan. 24, 2019
Applicant:

Ls Mtron Ltd., Anyang-si, KR;

Inventors:

Sung Hyun Kim, Anyang-si, KR;

Heui Soo Kim, Anyang-si, KR;

Yong Hyeon Yoo, Anyang-si, KR;

Assignee:

LS MTRON LTD, Anyang-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 11/76 (2013.01); H01G 11/10 (2013.01); H01G 11/82 (2013.01); H01G 11/78 (2013.01); H01G 2/06 (2006.01); H02J 7/00 (2006.01); H01M 10/42 (2006.01); H01G 9/08 (2006.01); H01M 50/213 (2021.01); H01M 50/502 (2021.01);
U.S. Cl.
CPC ...
H01G 11/76 (2013.01); H01G 2/06 (2013.01); H01G 11/10 (2013.01); H01G 11/78 (2013.01); H01G 11/82 (2013.01); H02J 7/0014 (2013.01); H01G 9/08 (2013.01); H01M 10/4257 (2013.01); H01M 50/213 (2021.01); H01M 50/502 (2021.01); H01M 2010/4271 (2013.01);
Abstract

An energy storage device module comprises: a plurality of energy storage devices having a first energy storage device and a second energy storage device; a connection member configured to connect a first external terminal of the first energy storage device and a second external terminal of the second energy storage device adjacent to the first energy storage device; and a circuit board including a hole that passes through the first external terminal of the first energy storage device, a board protrusion supported by a curling processed portion formed in a body case of the first energy storage device, a first conductive metal layer formed in a region adjacent to the hole and in contact with the connection member, and a second conductive metal layer formed in a region of the board protrusion and in contact with the curling processed portion.


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