The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Aug. 14, 2018
Applicant:

Research Institute of Petroleum Exploration & Development, Petrochina Company Limited, Beijing, CN;

Inventors:

Dewen Zheng, Beijing, CN;

Zhide Wu, Beijing, CN;

Guosheng Ding, Beijing, CN;

Huayin Zhu, Beijing, CN;

Jianfeng Liu, Beijing, CN;

Lina Ran, Beijing, CN;

Tong Lin, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01V 1/00 (2006.01); G01V 1/16 (2006.01);
U.S. Cl.
CPC ...
G01V 1/166 (2013.01); G01V 2210/123 (2013.01); G01V 2210/1232 (2013.01); G01V 2210/1429 (2013.01);
Abstract

The present invention describes a mechanical coupling microseismic monitoring system, which includes at least one microseismic sensor, push rods that are arranged at both ends of the microseismic sensor through a first connection mechanism to send the microseismic sensor into the monitoring hole, introduction mechanisms that are mounted on the push rods for introducing the microseismic sensor into the monitoring hole, and one microseismic monitoring computer that receives signals from the microseismic sensor; the microseismic sensor is a recoverable microseismic sensor; the first connection mechanism is a connection mechanism that can make the push rod swing relative to the microseismic sensor; the introduction mechanism is a three-roller introduction mechanism. The present invention meets the requirement of microseismic monitoring for different parts of deep monitoring hole using multiple microseismic sensors.


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