The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Mar. 04, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Kushagra Sinha, Wappingers Falls, NY (US);
Pablo Nieves, Schenectady, NY (US);
Reinaldo Vega, Mahopac, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); G01R 1/04 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07392 (2013.01); G01R 1/0408 (2013.01); G01R 31/2886 (2013.01); G01R 31/2887 (2013.01); G01R 31/2889 (2013.01); G01R 31/2891 (2013.01); G01R 31/2893 (2013.01); G01R 3/00 (2013.01); G01R 31/2808 (2013.01);
Abstract
A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.