The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
May. 30, 2019
Applicant:
Miramems Sensing Technology Co., Ltd, Suzhou Industrial Park, CN;
Inventors:
Li-Tien Tseng, Taoyuan, TW;
Yu-Hao Chien, Taipei, TW;
Chih-Liang Kuo, Hsinchu, TW;
Yu-Te Yeh, Hsinchu, TW;
Assignee:
MIRAMEMS SENSING TECHNOLOGY CO., LTD, Suzhou, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/14 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
G01L 1/142 (2013.01); B81B 3/0072 (2013.01); B81B 2203/0376 (2013.01); B81B 2203/0392 (2013.01);
Abstract
A force sensor includes a package substrate, a MEMS-based device, a package body and a force touching member. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The force touching member including a rod is disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.