The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jul. 15, 2016
Applicant:
Uacj Corporation, Tokyo, JP;
Inventors:
Wataru Narita, Tokyo, JP;
Atsushi Fukumoto, Tokyo, JP;
Assignee:
UACJ CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 21/16 (2006.01); C22F 1/057 (2006.01); C22C 21/14 (2006.01); F28F 21/08 (2006.01); B23K 35/02 (2006.01); B23K 35/28 (2006.01); B22D 7/00 (2006.01); B23K 1/00 (2006.01); B21B 1/22 (2006.01); C22C 21/00 (2006.01); C22F 1/04 (2006.01); B23K 35/22 (2006.01); F28F 9/18 (2006.01); F28F 9/02 (2006.01); C22C 21/10 (2006.01); C22C 21/02 (2006.01); B23K 101/14 (2006.01); B23K 103/10 (2006.01); C22F 1/00 (2006.01); B21B 3/00 (2006.01);
U.S. Cl.
CPC ...
C22C 21/16 (2013.01); B21B 1/22 (2013.01); B22D 7/005 (2013.01); B23K 1/0012 (2013.01); B23K 35/0222 (2013.01); B23K 35/0238 (2013.01); B23K 35/22 (2013.01); B23K 35/286 (2013.01); B23K 35/288 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22C 21/10 (2013.01); C22C 21/14 (2013.01); C22F 1/04 (2013.01); C22F 1/057 (2013.01); F28F 9/0226 (2013.01); F28F 9/18 (2013.01); F28F 21/084 (2013.01); B21B 2001/225 (2013.01); B21B 2003/001 (2013.01); B23K 2101/14 (2018.08); B23K 2103/10 (2018.08); C22F 1/00 (2013.01); F28F 2275/04 (2013.01);
Abstract
An aluminum alloy material comprises: Si: less than 0.2 mass %, Fe: 0.1 to 0.3 mass %, Cu: 1.0 to 2.5 mass %, Mn: 1.0 to 1.6 mass %, and Mg: 0.1 to 1.0 mass %, the balance being Al and incidental impurities. A number density of Al—Mn compound having a circle equivalent diameter of not less than 0.1 μm is not less than 1.0×10mm, and a number density of AlCu having a circle equivalent diameter of not less than 0.1 μm is not more than 1.0×10mm.