logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11136484 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

Nov. 30, 2017

Thermally conductive sheet

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Masahiro Hamada, Shiraoka, JP;

Daisuke Mukohata, Saitama, JP;

Koji Shimonishi, Walled Lake, MI (US);

Yuuki Hoshiyama, Shiraoka, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Hui H Chin

Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 3/04 (2006.01); C08J 5/18 (2006.01); H01L 23/373 (2006.01); B32B 25/02 (2006.01); B32B 25/04 (2006.01); B32B 25/16 (2006.01); B32B 25/20 (2006.01); C08K 3/38 (2006.01); C08K 3/34 (2006.01); H05K 7/20 (2006.01); C08K 3/28 (2006.01); C08K 3/22 (2006.01); B32B 27/18 (2006.01); C08L 101/00 (2006.01); B32B 7/02 (2019.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B32B 7/02 (2013.01); B32B 25/02 (2013.01); B32B 25/042 (2013.01); B32B 25/16 (2013.01); B32B 25/20 (2013.01); B32B 27/18 (2013.01); C08J 5/18 (2013.01); C08K 3/04 (2013.01); C08K 3/042 (2017.05); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); C08L 101/00 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H05K 7/20 (2013.01); B32B 2250/248 (2013.01); B32B 2262/105 (2013.01); B32B 2262/106 (2013.01); B32B 2307/302 (2013.01); B32B 2457/14 (2013.01); C08J 2309/00 (2013.01); C08J 2309/02 (2013.01); C08J 2323/16 (2013.01); C08J 2383/04 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); H01L 23/373 (2013.01); H01L 23/3731 (2013.01); H01L 23/42 (2013.01);
Abstract

A heat-conducting sheet according to the present invention is a heat-conducting sheet having an initial Asker C hardness of 50 or less, the heat-conducting sheet containing an elastomer resin at the volume proportion of 30 to 70%, and a thermally conductive filler at the volume proportion of 30 to 70%, in which the elastomer resin has a viscosity at 25° C. of 3000 Pa·s or less, and the elastomer resin has a lamella length of 20 mm or more. According to the present invention, a heat-conducting sheet which has initial flexibility sufficient to exhibit excellent shape conformability and in which residual stress is reduced after compression by applying pressure can be provided.

Find Patent Forward Citations

Loading…