The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Mar. 29, 2019
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Seiichiro Shinohara, Kanuma, JP;

Yasushi Akutsu, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/10 (2018.01); C09J 5/06 (2006.01); C09J 9/02 (2006.01); B29C 35/08 (2006.01); B29C 43/00 (2006.01); B29C 43/20 (2006.01); B29D 7/01 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H01R 4/04 (2006.01); B29K 63/00 (2006.01); B29K 505/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); B29C 35/0805 (2013.01); B29C 43/003 (2013.01); B29C 43/203 (2013.01); B29D 7/01 (2013.01); C09J 5/06 (2013.01); C09J 9/02 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B29C 2035/0827 (2013.01); B29K 2063/00 (2013.01); B29K 2505/00 (2013.01); B29K 2995/0005 (2013.01); C09J 2301/208 (2020.08); C09J 2301/314 (2020.08); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29499 (2013.01); H01R 4/04 (2013.01); H05K 3/323 (2013.01); Y10T 428/24612 (2015.01);
Abstract

Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.


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