The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Sep. 28, 2020
Applicant:

Lms Consulting Group, Llc;

Inventors:

Shuyong Xiao, St-Laurent, CA;

Richard C. Abbott, New Boston, NH (US);

Assignee:

LMS CONSULTING GROUP, LLC, Marion, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/037 (2014.01); C09D 11/102 (2014.01); H05B 3/14 (2006.01); H05K 1/09 (2006.01); C09D 11/107 (2014.01); H05K 1/02 (2006.01); C09D 11/10 (2014.01); H05B 3/34 (2006.01); H05K 1/03 (2006.01); H05K 3/12 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 11/037 (2013.01); C09D 11/10 (2013.01); C09D 11/102 (2013.01); C09D 11/107 (2013.01); H05B 3/146 (2013.01); H05B 3/34 (2013.01); H05K 1/0212 (2013.01); H05K 1/038 (2013.01); H05K 1/095 (2013.01); H05K 1/097 (2013.01); H05B 2203/011 (2013.01); H05B 2203/013 (2013.01); H05B 2203/02 (2013.01); H05B 2203/036 (2013.01); H05K 1/162 (2013.01); H05K 3/12 (2013.01); H05K 2201/10196 (2013.01);
Abstract

A printed circuit that comprises a substrate, electrical interconnects and a double-resin ink having a positive temperature coefficient (PTC), wherein the double-resin ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the double-resin ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature 'T' and a resistance of the double-resin ink at 25 degrees Celsius. The substrate is a fabric or mesh, while the double-resin ink and the electrical interconnects are deposited onto the substrate.


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