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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11136437 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

Aug. 04, 2017

Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member

Applicant:

Dow Corning Toray Co., Ltd., Tokyo, JP;

Inventor:

Ryosuke Yamazaki, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:

Warner Norcross + Judd LLP

Primary Examiner:

Vickey Nerangis

Int. Cl.
CPC ...
C08L 83/04 (2006.01); H01L 23/29 (2006.01); C08G 77/00 (2006.01); C08K 3/00 (2018.01); C08J 5/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); B29K 83/00 (2006.01); B29K 509/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
C08G 77/80 (2013.01); B29C 45/0001 (2013.01); B29C 45/14639 (2013.01); C08J 5/00 (2013.01); C08K 3/00 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08L 83/04 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/29 (2013.01); H01L 23/296 (2013.01); H01L 23/31 (2013.01); B29C 2045/0091 (2013.01); B29K 2083/00 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3406 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2201/005 (2013.01); C08K 2201/014 (2013.01);
Abstract

Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150° C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30° C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 μm or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C.

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