The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jan. 13, 2020
Applicant:
Mitsubishi Polyester Film Gmbh, Wiesbaden, DE;
Inventors:
Herbert Peiffer, Mainz, DE;
Martin Jesberger, Mainz, DE;
Bodo Kuhmann, Runkel, DE;
Stephan Audörsch, Darmstadt, DE;
Assignee:
Mitsubishi Polyester Film GmbH, Wiesbaden, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/02 (2006.01); B32B 27/36 (2006.01); B65D 65/40 (2006.01); B65D 81/34 (2006.01); B29C 48/00 (2019.01); B29C 48/08 (2019.01); B29C 48/21 (2019.01); B29C 55/00 (2006.01); B29C 55/12 (2006.01); B32B 27/08 (2006.01); B65D 1/34 (2006.01); B65D 81/24 (2006.01); B29K 67/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B65D 65/40 (2013.01); B29C 48/0018 (2019.02); B29C 48/022 (2019.02); B29C 48/08 (2019.02); B29C 48/21 (2019.02); B29C 55/005 (2013.01); B29C 55/12 (2013.01); B32B 1/02 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B65D 1/34 (2013.01); B65D 81/24 (2013.01); B65D 81/343 (2013.01); B29K 2067/00 (2013.01); B29L 2031/712 (2013.01); B32B 2307/31 (2013.01); B32B 2307/51 (2013.01); B32B 2307/518 (2013.01); B32B 2307/581 (2013.01); B32B 2307/72 (2013.01); B32B 2439/02 (2013.01); B32B 2439/70 (2013.01);
Abstract
The invention relates to transparent packaging for vacuum forming, inter alia, formed from a biaxially oriented, thermoformable polyester film as lower film (A) and a biaxially oriented polyester film as upper film (B) that is both heat-sealable and peelable (at least when the material is hot) in relation to the lower film (A). The present invention further relates to the use of such packaging to produce sealed, thermoformed packs, and to the processes for their respective production.